HY485 toughened epoxy adhesive is a two-component, self-leveling, fast curing epoxy resin potting material at room temperature. It has excellent aging resistance, moisture resistance, electrical insulation, elastic shock resistance and high breakdown voltage.
| Model | HY485T | HY485B |
| Appearance and color | Transparent | Gray-black |
| Viscosity (Pa•s, 23℃) | 15~50 | 25~60 |
| Density (g/cm3) | 1.05±0.2 | 1.5±0.2 |
| Volume ratio (A:B) | 1:1 | 1:1 |
| Operation time (min, 23℃) | 5 | 5 |
| Tack-free time (min, 23℃) | 10~15 | 10~15 |
| Shore hardness (S.D) | 75~85 | 75~85 |
| Shear strength (MPa) | 15~25 | 15~25 |
| Elongation (%) | 5~20 | 5~20 |
| Flame retardant grade (UL94) | HB | 0 |
| Operating temperature range (℃) | -50~120 | -50~120 |
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